Effect of cold drawing deformation on the microstructure and properties of pure copper

LIU Ruoxu; MAO Xiqin; OU Meigui; LIANG Yu; XIAO Qiulei

doi:10.13264/j.cnki.ysjskx.2022.02.009

Volume 13 Issue 2

Apr. 2022

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Nonferrous Metals Science and Engineering > 2022 > 13(2): 67-75. > DOI: 10.13264/j.cnki.ysjskx.2022.02.009

LIU Ruoxu, MAO Xiqin, OU Meigui, LIANG Yu, XIAO Qiulei. Effect of cold drawing deformation on the microstructure and properties of pure copper[J]. Nonferrous Metals Science and Engineering, 2022, 13(2): 67-75. DOI: 10.13264/j.cnki.ysjskx.2022.02.009

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Effect of cold drawing deformation on the microstructure and properties of pure copper

LIU Ruoxu^{1, 2},
MAO Xiqin^{1, 2},
OU Meigui^{1, 2, ,},
LIANG Yu^{1, 2},
XIAO Qiulei³

1.
College of Materials and Metallurgy, Guizhou University, Guiyang 550025, China
2.
National Local Joint Engineering Laboratory for High Performance Metal Structure Materials and Manufacturing Technology, Guiyang 550025, China
3.
Guda Wire and Cable (Group) Co., Ltd., Anshun 561000, Guizhou, China

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Received Date: July 03, 2021
Revised Date: September 09, 2021
Available Online: May 09, 2022

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Abstract

Abstract

Wires with different deformations were obtained by multipass cold drawing of a pure copper bar by an industrial wire drawing machine. The annealing experiments were carried out at 400 ℃ for 1 h to study the effects of microstructure changes on the mechanical and electrical properties of wires with different deformations. When the deformation of the samples increased from 0 to 60%, the grain size in the drawing direction (DD) decreased from 101.3 μm to 17.6 μm, the grain size in the transverse direction (TD) decreased from 103.4 μm to 16.4 μm, and the grain size was equiaxed. When the deformation amount increased to 90%, the grain size in the drawing direction was 14.1 μm, and the grain size in the section direction was 7.6 μm. The specimen microstructure consisted of deformed grains and equiaxed grains. When the deformation increased from 0 to 90%, the tensile strength increased from 221.5 MPa to 271.5 MPa. When the deformation was 60%, the tensile strength was 244.9 MPa, the elongation reached the highest value of 51%, and the electrical conductivity was 99.4% IACS. The orientation ratio of < 111 > + < 100 > in the samples was inversely proportional to the elongation of the samples. The in situ tensile observation showed that the crack propagation path was more tortuous in the process of cracks crossing the grain boundary for annealed samples. For the drawn samples, crack initiation occurred in the deformed grain, and the crack propagation path was relatively straight.
- pure copper,
- drawing deformation,
- heat treatment,
- mechanical properties,
- crack propagation

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Effect of cold drawing deformation on the microstructure and properties of pure copper

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