几种铜材组织缺陷的电镜与能谱分析

SEM and EDS Analysis on the Structural Defects of Copper Materials

摘要: 对生产中常见的铜材组织缺陷采用扫描电镜、能谱仪进行分析，归纳出3种典型组织缺陷表面粘连、气孔和内部夹杂物的形貌与成分特征.

Abstract: This paper studies several common structure defects in copper production process by SEM and EDS. The morphology and composition features of typical defects, such as excessive outgrowth, gas holes and nonmetallic inclusions are summed up.