电化学法分析铜箔添加剂及其组织性能

Electrochemical analysis of copper foil additives and their microstructure properties

  • 摘要: 有机添加剂对电解铜箔起着决定性作用,浓度的变化直接影响电解铜箔的组织性能。本文采用循环伏安剥离法(CVS),定量分析3-巯基-1-丙烷磺酸钠(MPS)、聚乙二醇(PEG)和胶原蛋白的组合添加剂体系的浓度消耗,实现镀液成分有效调控和铜箔性能稳定。实验结果表明,连续电解铜箔后,MPS由最初的5.17 mg/L降为0.05 mg/L,PEG与胶原蛋白浓度变化微小。依据加标回收测试,MPS的测定回收率为97.41%~102.93%,相对标准偏差为1.23%~5.47%。MPS的大量消耗,导致晶粒尺寸骤增至7.49 μm,粗糙度上升至4.21 μm,同时促使(111)晶面择优生长,提升抗拉强度最高至452.67 MPa,延伸率最低下降至0.67%。基于CVS检测结果,补充MPS浓度,铜箔恢复至初始性能,晶粒尺寸为3.66 μm,粗糙度为1.05 μm,择优取向为(111)与(200)晶面,抗拉强度为376.47 MPa,延伸率为2.38%。

     

    Abstract: Organic additives play a crucial role in the production of electrolytic copper foil, as their concentration fluctuations directly affect the microstructure and properties of the foil. In this study, cyclic voltammetry stripping (CVS) was used to quantitatively analyze the concentration depletion in a combined additive system consisting of sodium 3-mercapto-1-propanesulfonate (MPS), polyethylene glycol (PEG), and collagen. This approach aimed to achieve effective regulation of the plating solution composition and stabilize copper foil performance. Experimental results showed that the MPS decreased from an initial 5.17 mg/L to 0.05 mg/L after continuous electrolysis of copper foil, while the concentrations of PEG and collagen changed slightly. According to the spiked recovery tests, the recovery rate of MPS ranged from 97.41% to 102.93% with a relative standard deviation of 1.23% to 5.47%. The large amount of MPS consumption led to a sharp increase in grain size to 7.49 μm, and surface roughness to 4.21 μm. Furthermore, it prompted the preferential growth of the (111) grain surface, resulting in a maximum tensile strength of 452.67 MPa and a minimum elongation of 0.67%. Based on CVS test results, the depleted MPS was replenished, restoring the copper foil to its initial properties: a grain size of 3.66 μm, a roughness of 1.05 μm, preferential orientation along the (111) and (200) planes, a tensile strength of 376.47 MPa, and an elongation of 2.38%.

     

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