Abstract: In this paper, the effects of sodium 3-mercapto-1-propanesulfonate (MPS), hydroxymethyl cellulose, gelatin and sodium saccharin on Cu electrodeposition were investigated by linear scanning voltammetry and cyclic voltammetric analysis, and the effect of additives on the tensile strength and elongation of copper foil was optimized by response surface method. Hydroxymethylcellulose and gelatin have inhibitory effects on copper electrodeposition, and gelatin has a better inhibitory effect than hydroxymethylcellulose. MPS shows a promoting effect, and its promoting effect does not change with concentration when the concentration is greater than 8 mg/L. Saccharin sodium has no significant effect on copper electrodeposition, and when combined with additives, its promoting or inhibiting effect is between that of a single additive. The response surface results show that the optimal ratio for tensile strength is achieved when the concentrations of MPS, hydroxymethylcellulose, and gelatin are 4, 8, 6 mg/L, respectively, and the highest elongation is achieved when the concentrations are 6, 3, 7 mg/L.