表面活性剂对金属铜微切削过程中微沟槽显微形貌影响机制的研究

Physiochemical effect of surfactant on the microgroove microstructure in microcutting of pure copper

  • 摘要: 本研究对微沟槽横截面微观组织进行了观察,阐明了表面活性剂对纯铜微切削加工表面的机理影响。研究结果表明:添加表面活性剂后,切削力和推力明显降低,并发现具有物理化学效应的微沟槽表面粗糙度为12 nm,没有物理化学效应的微沟槽表面粗糙度为17 nm。受物理化学效应影响的样品的微沟槽区内的平均晶粒尺寸为67.9 μm,而无物理化学效应影响的样品平均晶粒尺寸为48.3 μm,此外,还发现无物理化学效应影响微沟槽附近晶粒尺寸大于远离微沟槽表面的晶粒尺寸。通过电子背散射衍射显微镜观察,受物理化学效应影响的横截面表面晶粒呈各向异性,而无物理化学效应影响的横截面表面晶粒取向主要为{101} 方向。通过对几何必要位错计算和分析,推断出在微切削过程中,具有物理化学效应的样品中残余应力和温度较高,可以为再结晶提供足够的驱动能量。

     

    Abstract: The physiochemical effect of surfactant on the machining of pure copper was clarified by the study on microstructure characterization on the cross-sectioned microgroove. An obvious decreased cutting force and thrust force were obtained by adding surfactant. It could be found that the surface roughness of microgroove with physiochemical effect was 12 nm, and that without physiochemical effect was 17 nm. The average grain size of the medium-affected sample was 67.9 μm within the microgroove zone, and that of the medium-free sample was 48.3 μm within the microgroove zone. Moreover, the grain size of medium-free microgroove near the microgroove surface was larger than that far away from the microgroove surface. Additionally, observed by electron backscattering diffraction microscopy, the grain orientations of medium-affected cross-sectioned surface presented anisotropy, while that of medium-free cross-sectioned surface were towards 101 direction. Based on the calculation and analysis of geometrically necessary dislocation, it can be inferred that the induced stress and temperature in the sample with physiochemical effect are higher than that without physiochemical effect in the microcutting process, which can provide enough driving energy for recrystallization.

     

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