Abstract: With the rapid development of electronic technology and the upgrading of electronic devices, the requirement for electronic packaging materials is getting higher than before. Metal matrix composites, especially aluminum and copper matrix composites have the characteristics of high thermal conductivity, low expansion, and high stability, which are electronic packaging materials with broad application prospects. However, diamond, graphene, silicon, and other reinforcements have poor wettability with the matrix, or have harmful interface reaction with the matrix at high temperature, which limits the development and application of metal matrix composites with the high thermal conductivity. This paper briefly described the research progress of interface of metal matrix composites, and proposed several methods to improve the interface bonding based on the factors that affect the interface bonding of metal matrix composites. Surface modification of reinforcement is one of the most important ways to improve the interface of metal matrix composites. The common technologies include magnetron sputtering, chemical vapor deposition, sol-gel and electroless plating. Finally, the application of surface modification of reinforcement in metal matrix composites with high thermal conductivity was analyzed and prospected.