铜箔表面硅烷化处理及其耐腐蚀性能

Study on corrosion resistance of copper foil by surface silylation treatment

  • 摘要: 采用动电位极化与交流阻抗谱方法, 研究了电解铜箔经不同剂量的硅烷偶联剂γ-APT表面硅烷化处理后在3.5 % NaCl溶液中的腐蚀防护效果.实验通过改变硅烷与乙醇、水为溶剂配比以及溶液pH值、固化温度、固化时间等因素,探索自组装形成的有机膜对铜箔影响效果.结果表明:γ-APT自组装膜具有良好的耐腐蚀性能,其中含量为2.0 %,pH值为5的γ-APT硅烷液涂覆铜箔经100 ℃固化1 h自组装形成的有机膜防腐效果较优.

     

    Abstract: We studied the electrolytic copper foil's corrosion protection effect after γ-APT surface silylation treatment by the electrodynamic polarization and electrochemical impedance spectroscopy (EIS) analysis. The experiment was carried out in 3.5 % NaCl solution with various dosages of silane coupling agent. We systematically investigated the corrosion resistance of self-assembled organic film on copper foil under different conditions by changing the ratio of silane to ethanol and water, pH value, curing temperature and curing time. The results reveal that the self-assembled γ-APT film has good corrosion resistance. The optimum technique is 2.0 % γ-APT silane liquid content under pH value of 5, 100 ℃ and one hour's curing time.

     

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