Cu-Ni-Si-P合金冷加工硬化及再结晶温度的研究

Cold hardening and recrystallization temperature of Cu-Ni-Si-P alloy

  • 摘要: 为全面掌握Cu-Ni-Si-P合金的加工特性及再结晶的退火制度,并指导产业化生产,对Cu-Ni-Si-P合金的冷加工特性展开研究,且通过对不同厚度退火后试样进行抗拉强度、延伸率的测试和组织观察,确定出新型Cu-Ni-Si-P合金的再结晶退火制度.试验结果表明,Cu-Ni-Si-P合金具有明显的加工硬化特征;合金的抗拉强度随加工率的增大,呈先快速增大后趋于平稳的趋势,而延伸率和导电率,则呈现相反的变化规律;变形量越大,则相应的开始再结晶温度越低;综合优化出Cu-Ni-Si-P合金在80 %加工率的再结晶退火温度制度为460 ℃×1 h.

     

    Abstract: In order to have a comprehensive grasp of Cu-Ni-Si-P alloy processing characteristics and guide the industrialization production, cold working characteristics of the Cu-Ni-Si-P alloy were studied. The new Cu-Ni-Si-P alloy recrystallization annealing system through testing the tensile strength and elongation and observing the microstructure of different thickness samples after annealing was determined. The results show that the Cu-Ni-Si-P alloy shows obvious work hardening effect after cold deformation. The strength of the alloy increases at first, then keeps invariant with the working rate increases, the elongation and electrical conductivity exhibits opposite change rule. The greater the deformation degree, the lower of the beginning of the alloy recrystallization temperature. The system of recrystallization annealing temperature of optimized Cu-Ni-Si-P alloy at 80 % working rate is 460 ℃ by 1h.

     

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