电沉积钨基合金镀层工艺研究

Coating process conditions of W alloy electrodeposition

  • 摘要: 采用电沉积方法在中碳钢基底上制备了Ni-W 合金镀层.通过正交试验设计方法研究了制备工艺,利用极差分析了各关键因素对合金镀层性能的影响,获得了镀液配方及最佳工艺条件,并通过扫描电子显微镜、X 射线衍射仪等分析测试手段,对镀层形貌、成分、结构、硬度等进行了研究.结果表明,影响显微硬度最大的因素为NaI 含量,其次是电流密度Dk.制备Ni-W 镀层表面未见有明显缺陷,镀层与基体的结合良好,显微硬度Hv0.3 为650 左右.

     

    Abstract: Electroplating Ni-W coatings were prepared on medium carbon steel substrate.Preparation technique was studied through orthogonal experiment design method, using poor analysis method to analyze the various factors affecting the performance of alloy coatings, solution formula and optimum process conditions. Composition, microstructures and performance were analyzed by scanning electron microscope, x-ray diffraction, optical microscopy and microhardness tester. The results show that of all the factors affecting the microhardness, NaI content is the strongest, and followed by current density. The surface of Ni-W alloy coatings is not found to have obvious flaws and has a good bond with the matrix. The microhardness of the coatings can reach 650 HV.

     

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