Abstract: The production of ultra-thin copper foil mainly uses carrier foil with a certain thickness as the cathode, with electro-deposition of copper on it. The key technology of the ultra-thin copper foil production is the peeling of the ultra -thin copper foil from the carrier. This paper summarizes the current researches on the peeling layer between the ultra-thin copper foil and the carrier. The prospect for the ultra-thin copper foil production is also predicted.