Cause analysis and countermeasures of exfoliation of copper powders on copper rod and wire

The exfoliation of copper powders induces the damage of the copper rod and copper wire on surface which has a great influence during the stretching of the copper rod and copper wire. By SEM and XRD analysis, the thickness of the exfoliation can be 25 μm and the main compositions are copper and its oxide. By inspecting and analyzing morphology of the exfoliation materials and surface defects of the copper wire, the production and fabrication process of the copper rod and wire are researched to verify the rolling mill practice, in-acidity process, wire surface wound, stretch angle and wire-drawing die as the five risk factors contribute to surface quality, and to formulate the corresponding measures. The researches show that the main reasons of the exfoliation of copper powders are copper rod oxide exfoliation and mechanical injury. During the production and the fabrication process of the copper rod and copper wire, the effective way to reduce the exfoliation of copper powders on the copper rod and copper wire is to prevent oxide from getting into copper matrix and to avoid the copper wire surface being injured.